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1

Anisotropic conductive films (ACFs) for ultra-fine pitch Chip-On-Glass (COG) applications

Myung Jin Yim, Jinsang Hwang, Kyung Wook Paik

Journal:

International Journal of Adhesion and Adhesives

Year:

2007

Language:

english

File:

PDF, 483 KB

english, 2007

2

Ultrasonic Bonding Using Anisotropic Conductive Films (ACFs) for Flip Chip Interconnection

Kiwon Lee, Hyoung-Joon Kim, Myung-Jin Yim, Kyung-Wook Paik

Journal:

IEEE Transactions on Electronics Packaging Manufacturing

Year:

2009

Language:

english

File:

PDF, 2.12 MB

english, 2009

3

Adhesion and Reliability of Anisotropic Conductive Films (ACFs) Joints on Organic Solderability Preservatives (OSPs) Metal Surface Finish

Hyoung-Joon Kim, Kyung-Wook Paik

Journal:

Journal of Electronic Materials

Year:

2008

Language:

english

File:

PDF, 991 KB

english, 2008

4

Multifunctional effect of probiotic Lactococcus lactis KC24 isolated from kimchi

Lee, Na-Kyoung, Han, Kyoung Jun, Son, Sung-Ho, Eom, Su Jin, Lee, Si-Kyung, Paik, Hyun-Dong

Journal:

Lebensmittel-Wissenschaft und-Technologie / Food Science and Technology

Year:

2015

Language:

english

File:

PDF, 375 KB

english, 2015

5

Pb-free Sn/3.5Ag electroplating bumping process and under bump metallization (UBM)

Se-Young Jang,, Wolf, J., Ehrmann, O., Gloor, H., Reichl, H., Kyung-Wook Paik,

Journal:

IEEE Transactions on Electronics Packaging Manufacturing

Year:

2002

Language:

english

File:

PDF, 1.60 MB

english, 2002

6

Effects of the Nylon Anchoring Polymer Layer on the Conductive Particle Movements of Anisotropic Conductive Films for Ultrafine Pitch Chip-on-Glass Applications

Yoon, Dal-Jin, Lee, Sang-Hoon, Paik, Kyung-Wook

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2018

Language:

english

File:

PDF, 1.67 MB

english, 2018

7

[IEEE 2018 IEEE Visual Communications and Image Processing (VCIP) - Taichung, Taiwan (2018.12.9-2018.12.12)] 2018 IEEE Visual Communications and Image Processing (VCIP) - Improving Generative Adversarial Networks with Adaptive Control Learning

Ma, Xiaohan, Jin, Rize, Sohn, Kyung-Ah, Paik, JoonYoung, Sun, Jing, Chung, Tae-Sun

Year:

2018

Language:

english

File:

PDF, 459 KB

english, 2018

8

Effect of Conductive Particle Properties on the Reliability of Anisotropic Conductive Film for Chip-on-Glass Applications

Yim, Myung Jin, Chung, Chang-Kyu, Paik, Kyung Wook

Journal:

IEEE Transactions on Electronics Packaging Manufacturing

Year:

2007

Language:

english

File:

PDF, 1.35 MB

english, 2007

9

Mechanical Reliability and Bump Degradation of ACF Flip Chip Packages Using BCB (Cyclotene™) Bumping Dielectrics Under Temperature Cycling

Kwon, Woon-Seong, Kim, Hyoung-Joon, Paik, Kyung-Wook, Jang, Se-Young, Hong, Soon-Min

Journal:

Journal of Electronic Packaging

Year:

2004

Language:

english

File:

PDF, 405 KB

english, 2004

10

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - A novel double layer NCF for highly reliable micro-bump interconnection

Shin, Ji-Won, Choi, Yong-Won, Kim, Young Soon, Kang, Un Byung, Seo, Sun Kyung, Paik, Kyung-Wook

Year:

2014

Language:

english

File:

PDF, 2.12 MB

english, 2014

11

A Combined Study of TEM-EDS/XPS and Molecular Modeling on the Aging of THPP, ZPP, and BKNO3 Explosive Charges in PMDs under Accelerated Aging Conditions

Kim, Kyung, Lee, Junwoo, Choi, Sung, Ahn, Gil, Paik, Jong, Ryu, Byung, Kim, Yong, Won, Yong

Journal:

Year:

2019

Language:

english

File:

PDF, 1.62 MB

english, 2019

12

Flexible Chip-on-Flex (COF) and embedded Chip-in-Flex (CIF) packages by applying wafer level package (WLP) technology using anisotropic conductive films (ACFs)

Kyoung-Lim Suk, Ho-Young Son, Chang-Kyu Chung, Joong Do Kim, Jin-Woo Lee, Kyung-Wook Paik

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 2.54 MB

english, 2012

13

Comparison of electroplated eutectic Bi/Sn and Pb/Sn solder bumps on various UBM systems

Se-Young Jang,, Kyung Wook Paik,

Journal:

IEEE Transactions on Electronics Packaging Manufacturing

Year:

2001

Language:

english

File:

PDF, 168 KB

english, 2001

14

[IEEE 2007 Proceedings 57th Electronic Components and Technology Conference - Sparks, NV, USA (2007.05.29-2007.06.1)] 2007 Proceedings 57th Electronic Components and Technology Conference - Adhesion and Reliability of Anisotropic Conductive Films (ACFs) Joints on Organic Solderability Preservatives (OSPs) Metal Surface Finish

Kim, Hyoung-Joon, Paik, Kyung-Wook

Year:

2007

Language:

english

File:

PDF, 5.90 MB

english, 2007

15

Effects of Nattokinase on Blood Pressure: A Randomized, Controlled Trial

KIM, Ji Young, GUM, Si Nae, PAIK, Jean Kyung, LIM, Hyo Hee, KIM, Kyong-Chol, OGASAWARA, Kazuya, INOUE, Kenichi, PARK, Sungha, JANG, Yangsoo, LEE, Jong Ho

Journal:

Hypertension Research

Year:

2008

Language:

english

File:

PDF, 138 KB

english, 2008

16

Application of electronic speckle-pattern interferometry to measure in-plane thermal displacement in flip-chip packages

Baik-Woo Lee, Woosoon Jang, Dong-Won Kim, Jeung-hyun Jeong, Jae-Woong Nah, Kyung-Wook Paik, Dongil Kwon

Journal:

Materials Science and Engineering: A

Year:

2004

Language:

english

File:

PDF, 355 KB

english, 2004

17

Studies on various chip-on-film (COF) packages using ultra fine pitch two-metal layer flexible printed circuits (two-metal layer FPCs)

Kyoung-Lim Suk, Kyosung Choo, Sung Jin Kim, Jong-Soo Kim, Kyung-Wook Paik

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 1.48 MB

english, 2012

18

Review of Recent Advances in Electrically Conductive Adhesive Materials and Technologies in Electronic Packaging

Yim, Myung Jin, Li, Yi, Moon, Kyoung-sik, Paik, Kyung Wook, Wong, C. P.

Journal:

Journal of Adhesion Science and Technology

Year:

2008

Language:

english

File:

PDF, 2.91 MB

english, 2008

19

A study on thermal cycling (T/C) reliability of anisotropic conductive film (ACF) flip chip assembly for thin chip-on-board (COB) packages

Kyung-Woon Jang, Jin-Hyoung Park, Soon-Bok Lee, Kyung-Wook Paik

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 1.14 MB

english, 2012

20

Wafer-Level Flip Chip Packages Using Preapplied Anisotropic Conductive Films (ACFs)

Son, Ho-Young, Chung, Chang-Kyu, Yim, Myung-Jin, Hwang, Jin-Sang, Paik, Kyung-Wook, Jung, Gi-Jo, Lee, Jun-Kyu

Journal:

IEEE Transactions on Electronics Packaging Manufacturing

Year:

2007

Language:

english

File:

PDF, 1.69 MB

english, 2007

21

Effects of ACF Bonding Parameters on ACF Joint Characteristics for High-Speed Bonding Using Ultrasonic Bonding Method

Kim, Yoo-Sun, Lee, Kiwon, Paik, Kyung-Wook

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2013

Language:

english

File:

PDF, 1003 KB

english, 2013

22

Effect of Flux Activators on the Solder Wettability of Solder Anisotropic Conductive Films

Seung-Ho Kim,, Yongwon Choi,, Yoo-Sun Kim,, Kyung-Wook Paik,

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2015

Language:

english

File:

PDF, 1.71 MB

english, 2015

23

Highly reliable non-conductive adhesives for flip chip CSP applications

Myung-Jin Yim,, Jin-Sang Hwang,, Woonseong Kwon,, Kyung Woon Jang,, Kyung-Wook Paik,

Journal:

IEEE Transactions on Electronics Packaging Manufacturing

Year:

2003

Language:

english

File:

PDF, 846 KB

english, 2003

24

Effects of Cu/Al intermetallic compound (IMC) on copper wire and aluminum pad bondability

Hyoung-Joon Kim,, Joo Yeon Lee,, Kyung-Wook Paik,, Kwang-Won Koh,, Jinhee Won,, Sihyun Choe,, Jin Lee,, Jung-Tak Moon,, Yong-Jin Park,

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2003

Language:

english

File:

PDF, 929 KB

english, 2003

25

The contact resistance and reliability of anisotropically conductive film (ACF)

Myung-Jin Yim,, Kyung-Wook Paik,

Journal:

IEEE Transactions on Advanced Packaging

Year:

1999

Language:

english

File:

PDF, 1.15 MB

english, 1999

26

Recent advances on anisotropic conductive adhesives (ACAs) for flat panel displays and semiconductor packaging applications

Myung Jin Yim, Kyung Wook Paik

Journal:

International Journal of Adhesion and Adhesives

Year:

2006

Language:

english

File:

PDF, 594 KB

english, 2006

27

Crcu based UBM (under bump metallization) study with electroplated Pb/63Sn solder bumps - interfacial reaction and bump shear strength

Se-Young Jang,, Wolf, J., Ehrmann, O., Gloor, H., Schreiber, T., Reichl, H., Kyung-Wook Paik,

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2003

Language:

english

File:

PDF, 1.37 MB

english, 2003

28

Thermodynamic Analysis on the Aging of THPP, ZPP and BKNO3 Explosive Charges in PMDs

Kim, Kyung, Choi, Sung, Eom, Ki, Ahn, Gil, Paik, Jong, Ryu, Byung, Kim, Yong, Won, Yong

Journal:

Year:

2019

Language:

english

File:

PDF, 1.23 MB

english, 2019

29

Inter-laboratory comparison of sonic nozzles at KRISS

Jong S. Paik, Kyung Am Park, Joel T. Park

Journal:

Flow Measurement and Instrumentation

Year:

2000

Language:

english

File:

PDF, 327 KB

english, 2000

30

A Telerehabilitation Approach for Chronic Aphasia Following Stroke

Choi, Yoon-Hee, Park, Hae Kyung, Paik, Nam-Jong

Journal:

Telemedicine and e-Health

Year:

2015

Language:

english

File:

PDF, 366 KB

english, 2015

31

Lacrimal Gland Fistula After Cosmetic Lateral Canthoplasty

Ahn, Ye Jin, Jung, Su Kyung, Paik, Ji Sun, Yang, Suk-Woo

Journal:

Journal of Craniofacial Surgery

Year:

2013

Language:

english

File:

PDF, 573 KB

english, 2013

32

Comparison of urine, self-collected vaginal swab, and cervical swab samples for detecting human papillomavirus (HPV) with Roche Cobas HPV, Anyplex II HPV, and RealTime HR-S HPV assay

Cho, Hyun-Woong, Ouh, Yung-Taek, Hong, Jin Hwa, Min, Kyung Jin, So, Kyeong A., Kim, Tae Jin, Paik, E. Sun, Lee, Jeong‐Won, Moon, Jun Hye, Lee, Jae Kwan

Journal:

Journal of Virological Methods

Year:

2019

Language:

english

File:

PDF, 363 KB

english, 2019

33

Development of three-dimensional memory die stack packages using polymer insulated sidewall technique

Hyoung Soo Ko,, Kim, J.S., Hyun Gook Yoon,, Se Young Jang,, Sung Dong Cho,, Kyung Wook Paik,

Journal:

IEEE Transactions on Advanced Packaging

Year:

2000

Language:

english

File:

PDF, 123 KB

english, 2000

34

[IEEE 2007 International Conference on Electronic Materials and Packaging (EMAP 2007) - Daejeon, Korea (2007.11.19-2007.11.22)] 2007 International Conference on Electronic Materials and Packaging - Thermal stability at the anisotropic conductive films (ACFs)/ organic solderability preservatives (OSPs) Interface

Il Kim,, Hyoung-Joon Kim,, Kyung-Wook Paik,

Year:

2007

Language:

english

File:

PDF, 8.12 MB

english, 2007

35

The effect of the oxidation of Cu-base leadframe on the interface adhesion between Cu metal and epoxy molding compound

Soon-Jin Cho,, Kyung-Wook Paik,, Young-Gil Kim,

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Year:

1997

Language:

english

File:

PDF, 182 KB

english, 1997

36

[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Effects of thermo-compression bonding parameters on joint formation of micro-bumps in non-conductive film (NCF)

Shin, Ji-Won, Kim, Young Soon, Lee, Hyoung Gi, Kang, Un Byung, Seo, Sun Kyung, Paik, Kyung-Wook

Year:

2015

Language:

english

File:

PDF, 1.18 MB

english, 2015

37

Reduced thermal strain in flip chip assembly on organic substrate using low CTE anisotropic conductive film

Myung Jin Yim,, Young-Doo Jeon,, Kyung-Wook Paik,

Journal:

IEEE Transactions on Electronics Packaging Manufacturing

Year:

2000

Language:

english

File:

PDF, 567 KB

english, 2000

38

Immunomodulatory and Antidiabetic Effects of a New Herbal Preparation (HemoHIM) on Streptozotocin-Induced Diabetic Mice

Kim, Jong-Jin, Choi, Jina, Lee, Mi-Kyung, Kang, Kyung-Yun, Paik, Man-Jeong, Jo, Sung-Kee, Jung, Uhee, Park, Hae-Ran, Yee, Sung-Tae

Journal:

Evidence-based Complementary and Alternative Medicine

Year:

2014

Language:

english

File:

PDF, 712 KB

english, 2014

39

Effects of Conductive Particles on the Electrical Stability and Reliability of Anisotropic Conductive Film Chip-on-Board Interconnections

Chang-Kyu Chung, Gi-Dong Sim, Soon-Bok Lee, Kyung-Wook Paik

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2012

Language:

english

File:

PDF, 2.36 MB

english, 2012

40

Nanomaterials for Theranostics: Recent Advances and Future Challenges

Lim, Eun-Kyung, Kim, Taekhoon, Paik, Soonmyung, Haam, Seungjoo, Huh, Yong-Min, Lee, Kwangyeol

Journal:

Chemical Reviews

Year:

2015

Language:

english

File:

PDF, 3.72 MB

english, 2015

41

Epoxy/BaTiO3 composite films and pastes for high dielectric constant and low-tolerance embedded capacitors fabrication in organic substrates

Sung-Dong Cho, Jang, K.-W., Jin-Gul Hyun, Sangyong Lee, Kyung-Wook Paik, Hyungsoo Kim, Joung-Ho Kim

Journal:

IEEE Transactions on Electronics Packaging Manufacturing

Year:

2005

Language:

english

File:

PDF, 1.57 MB

english, 2005

42

Formation of Pb/63Sn solder bumps using a solder droplet jetting method

Ho-young Son, Jae-woong Nah, Kyung-wook Paik

Journal:

IEEE Transactions on Electronics Packaging Manufacturing

Year:

2005

Language:

english

File:

PDF, 1.92 MB

english, 2005

43

A study on coining processes of solder bumps on organic substrates

Jae-Woong Nah,, Kyung Wook Paik,, Tae-Kyung Hwang,, Won-Hoe Kim,

Journal:

IEEE Transactions on Electronics Packaging Manufacturing

Year:

2003

Language:

english

File:

PDF, 1.06 MB

english, 2003

44

A Study on the Nanofiber-Sheet Anisotropic Conductive Films (NS-ACFs) for Ultra-Fine-Pitch Interconnection Applications

Lee, Sang-Hoon, Paik, Kyung-Wook

Journal:

Journal of Electronic Materials

Year:

2017

Language:

english

File:

PDF, 2.29 MB

english, 2017

45

Effects of metal stacks and patterned metal profiles on the electromigration characteristics in super-thin AlCu interconnects for sub-0.13 μm technology

Min Hyung Lee, Yong Min Kwon, Sung Gyu Pyo, Han Choon Lee, Jae-Won Han, Kyung-Wook Paik

Journal:

Thin Solid Films

Year:

2011

Language:

english

File:

PDF, 1.68 MB

english, 2011

46

Effects of Cu and Pd addition on Au bonding wire/Al pad interfacial reactions and bond reliability

Sang-Ah Gam, Hyoung-Joon Kim, Jong-Soo Cho, Yong-Jin Park, Jeong-Tak Moon, Kyung-Wook Paik

Journal:

Journal of Electronic Materials

Year:

2006

Language:

english

File:

PDF, 571 KB

english, 2006

47

Ultrasonic Bonding of Anisotropic Conductive Films Containing Ultrafine Solder Balls for High-Power and High-Reliability Flex-On-Board Assembly

Won-Chul Kim, Kiwon Lee, Saarinen, I.J., Pykari, L., Kyung-Wook Paik

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2012

Language:

english

File:

PDF, 883 KB

english, 2012

48

[IEEE 2007 International Conference on Electronic Materials and Packaging (EMAP 2007) - Daejeon, Korea (2007.11.19-2007.11.22)] 2007 International Conference on Electronic Materials and Packaging - Effect of Sb addition in Sn-Ag-Cu solder balls on the drop test reliability of BGA packages with electroless nickel immersion gold (ENIG) surface finish

Yong-Sung Park,, Yong-Min Kwon,, Ho-Young Son,, Jeong-Tak Moon,, Byung-Wook Jeong,, Kyung-In Kang,, Kyung-Wook Paik,

Year:

2007

Language:

english

File:

PDF, 18.71 MB

english, 2007

49

A Study of Hygrothermal Behavior of ACF Flip Chip Packages With Moiré Interferometry

Park, Jin-Hyoung, Jang, Kyung-Woon, Paik, Kyung-Wook, Lee, Soon-Bok

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2010

Language:

english

File:

PDF, 790 KB

english, 2010

50

A Study on the Dynamic Bending Property of Chip-on-Flex Assembly Using Anchoring Polymer Layer Anisotropic Conductive Films

Pan, Yan, Oh, Seung-Jin, Kim, Ji-Hye, Kim, Taek-Soo, Paik, Kyung-Wook

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2020

File:

PDF, 3.35 MB

2020

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